Industry Directory | Manufacturer
The Original Manufacturer of smt machines and THT machines since 2003 ,We design the both the software and hardware by ourselves and manufacture in our company , the only one in China who can make the smt machines by itself .
Industry Directory | Manufacturer
We produce ESD garments (Smocks, T-Shirts, Polo-Shirts, Throusers, Caps, Sweatshirts, Winter coats,...). We develop and produce ESD Entrance systems, testers and gates.
New Equipment | Component Counters / SMD Counters
I.C.T | Smt Reel Digit Component Counting Systems Smd X-ray Chip Counter Overview Features: ● "99.98 ～ 100% " Accuracy● Best counting speed "around 7 secongds/ reel" ● 7 reel simultaneous 3x Counting speed "around 7 seconds" ● Including load
These Threaded Sealing Caps or Fluid Sealing Caps as they are also known, are made from a high quality LDPE plastic and come with a neoprene rubber disc which is secured within the head of the cap, allowing for a tight full seal that can be easily ti
Electronics Forum | Thu Sep 24 09:28:13 EDT 2015 | rgduval
No direct experience with this particular issue....but, I do know that measuring capacitance can be tricky. How are you arriving at this conclusion? Are you measuring the caps on the bench before assembly, and then on the boards post assembly? Cap
Electronics Forum | Sat Feb 05 13:25:32 EST 2005 | etienne
Just a basic suggestion.... Inspect the nozzle placing the component...because that is the only medium, apart from the PCB design, which can be causing the damage. It occurred in my Department.
Used SMT Equipment | Pick and Place/Feeders
Japan YAMAHA YV100-XTG placement machine: Patch speed: 0.135 seconds/CHIP SMD PCB size: L330XW250MM_L50XW50MM SMD components:0603(MM)-31MMX31MM components SOP SOJ PLCC SMD components can put 100 kinds (8MM) Mounter size: L1650XW1408X1
Used SMT Equipment | Pick and Place/Feeders
Japan YAMAHA YV100-XTG placement machine: Patch speed: 0.135 seconds/CHIP SMD PCB size: L330XW250MM_L50XW50MM SMD components:0603(MM)-31MMX31MM components SOP SOJ PLCC SMD components can put 100 kinds (8MM) Mounter size: L1650XW1408X1
Industry News | 2014-02-27 16:27:05.0
Count On Tools Inc. (COT)announces the launch of PB Swiss Tools’ MecaTorque tools. This new line of analog torque wrench screwdrivers is simple, reliable and safe for application.
Industry News | 2009-11-12 15:41:02.0
XDry Celebrates a Successfull Productronica
Parts & Supplies | Pick and Place/Feeders
Juki KE-750 matrix tray holder small size is 330x310mm / big size is 680x310mm (Can be customized according to customer demand) More SMT JUKI feeder parts in stock E1506706000 Juki Feeder Spring E2300706000 JUKI 16MM Feeder Spring E3
Parts & Supplies | Pick and Place/Feeders
JUKI Feeder Storage Cart (Can be customized according to customer demand) Specification : Dimension: 800 x 600 x 1100mm, L x W x H Material: Full Stainless Steel Structure: 2 layers, 40pieces per layer With fou
Technical Library | 2019-05-24 09:27:33.0
Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.
Technical Library | 2019-05-29 10:38:59.0
Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.
Quick Overview: The ADS- 3530 is ideal for electronic assemblers looking for an easy and affordable way to improve soldering speed and consistency. Dramatically more efficient and reliable than hand soldering or manual dipping, the ADS-3530 features
Quick Overview: The ADS- 3530 is ideal for electronic assemblers looking for an easy and affordable way to improve soldering speed and consistency. Dramatically more efficient and reliable than hand soldering or manual dipping, the ADS-3530 features
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
Career Center | , Illinois USA | Sales/Marketing
New Business Development Manager Location: Central US Total Compensation: $150,000 - $200,000 If you're getting sick and tired of seeing and hearing about continual layoffs within the EMS industry - or have been one of the recent casualties, and
